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Ixento has been dedicated to systematic quality control.
With its accumulated experience,Ixento is now capable of de-processing and imaging chips with minimum line widths of 65 nm. We also provide various services including de-capping, de-layering, staining, and SEM & TEM sample preparation. |
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De-capping
Using our vast experience and advanced equipment, Ixento can safely and efficiently provide decapsulation services for various types of packaging, including common plastics package, ceramic package, BGA, Flip-chip, and AsGa. We can retain the wire connection between the bounding Pads and package pins allowing for FIB testing.
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X-Ray Imaging
Our reliable tools allow us to check for bugs in chip packages with high resolution and enlarging capabilities.
De-layering
Ixento has vast experience in Cu/Au/Al processes as well as various poly materials. Ixento is also capable of de-layering the top layer of Flip-chip designs.
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Staining
Ixento is very experienced in active-staining in poly and well areas and ROM Code.
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Sample Preparation
SEM sample preparation: including fix-point /non-fix-point sample (AL & CU) preparation grinding.
TEM sample preparation: including slicing, beveling, non-fix-point /fix-point P-V sample preparation (SI sub), non-fix-point /fix-point X-S sample preparation (SI sub), non-fix-point P-V sample preparation (non-SI sub), fix-point P-V sample preparation (non-SI sub), non-fix-point X-S sample preparation (non-SI sub) . |
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